Research on Improving the Sound Insulation of Punching Distribution for Multi-Layer Partition

碩士 === 國立臺灣海洋大學 === 系統工程暨造船學系 === 105 === In this paper, we mainly study the punching of the interlayer of multi-layer sandwich plate to simulate the different punching distribution by filling the cushioning material or maintaining the air layer, and study the change of the sound transmission loss....

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Bibliographic Details
Main Authors: Wang, Kuei-Fu, 王奎夫
Other Authors: Liou, Der-Yuan
Format: Others
Language:zh-TW
Published: 2017
Online Access:http://ndltd.ncl.edu.tw/handle/j2vw6c