Reliability Assessment of Wafer Level Package using Modified Energy Based Model

Reliability Assessment of Wafer Level Package using Modified Energy Based Model

碩士 === 國立清華大學 === 動力機械工程學系 === 105 === abstract hide

Bibliographic Details
Main Authors: Tsou, Cheng-Yen, 鄒承諺
Other Authors: Chiang, Kuo-Ning
Format: Others
Language:zh-TW
Published: 2017
Online Access:http://ndltd.ncl.edu.tw/handle/p4jyx2
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spelling ndltd-TW-105NTHU53110492019-05-15T23:53:47Z http://ndltd.ncl.edu.tw/handle/p4jyx2 Reliability Assessment of Wafer Level Package using Modified Energy Based Model 以修正型能量密度法評估晶圓級封裝之可靠度 Tsou, Cheng-Yen 鄒承諺 碩士 國立清華大學 動力機械工程學系 105 abstract hide Chiang, Kuo-Ning 江國寧 2017 學位論文 ; thesis 77 zh-TW
collection NDLTD
language zh-TW
format Others
sources NDLTD
description 碩士 === 國立清華大學 === 動力機械工程學系 === 105 === abstract hide
author2 Chiang, Kuo-Ning
author_facet Chiang, Kuo-Ning
Tsou, Cheng-Yen
鄒承諺
author Tsou, Cheng-Yen
鄒承諺
spellingShingle Tsou, Cheng-Yen
鄒承諺
Reliability Assessment of Wafer Level Package using Modified Energy Based Model
author_sort Tsou, Cheng-Yen
title Reliability Assessment of Wafer Level Package using Modified Energy Based Model
title_short Reliability Assessment of Wafer Level Package using Modified Energy Based Model
title_full Reliability Assessment of Wafer Level Package using Modified Energy Based Model
title_fullStr Reliability Assessment of Wafer Level Package using Modified Energy Based Model
title_full_unstemmed Reliability Assessment of Wafer Level Package using Modified Energy Based Model
title_sort reliability assessment of wafer level package using modified energy based model
publishDate 2017
url http://ndltd.ncl.edu.tw/handle/p4jyx2
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