Reliability Assessment of Wafer Level Package using Modified Energy Based Model

碩士 === 國立清華大學 === 動力機械工程學系 === 105 === abstract hide

Bibliographic Details
Main Authors: Tsou, Cheng-Yen, 鄒承諺
Other Authors: Chiang, Kuo-Ning
Format: Others
Language:zh-TW
Published: 2017
Online Access:http://ndltd.ncl.edu.tw/handle/p4jyx2