Development of the Thermal Interface Materials for Joining Diamond/Cu Composites and Substrates

Development of the Thermal Interface Materials for Joining Diamond/Cu Composites and Substrates

碩士 === 國立清華大學 === 材料科學工程學系 === 105 === abstract hide

Bibliographic Details
Main Authors: Lai, Yi-An, 賴羿安
Other Authors: Chang, Shou-Yi
Format: Others
Language:zh-TW
Published: 2017
Online Access:http://ndltd.ncl.edu.tw/handle/w5v8p6

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