Development of the Thermal Interface Materials for Joining Diamond/Cu Composites and Substrates
碩士 === 國立清華大學 === 材料科學工程學系 === 105 === abstract hide
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2017
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| Online Access: | http://ndltd.ncl.edu.tw/handle/w5v8p6 |