Study of the Optimum Parameters of Finger Print Sensor IC in Wire Bonding for BGA Device
碩士 === 國立彰化師範大學 === 電機工程學系 === 105 === Finger Print Sensor (FPS) products have been applying popularly. Many consumer electronics manufacturers have been going into the operation of FPS. There are plenty of companies have integrated FPS products. However, the production capacity of BGA assemble hous...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2017
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| Online Access: | http://ndltd.ncl.edu.tw/handle/46fhgw |