Development of BCB Stacked Via, Electroless Nickel/Gold Plating, and Gold Flip-Chip Bump Processes for System-in-Package Applications
碩士 === 國立中央大學 === 電機工程學系 === 105 === The concept of System-in-Package (SiP) is to integrate chips and components implemented by different process technologies into one package and form a system. Flip-chip bonding is an important SiP technology, which is used to connect the chip and carrier substrate...
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| Format: | Others |
| Language: | zh-TW |
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2017
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| Online Access: | http://ndltd.ncl.edu.tw/handle/71812724482347284094 |