Adhesion Property of Polyimide and Passivation Layer with the Usage of Cobalt for Metal/Polymer Hybrid Bonding in 3D Integration
碩士 === 國立交通大學 === 電機資訊國際學程 === 105 === 3D integrated circuit (IC) is recognized as one of the promising approach in keeping up with Moore’s law in the semiconductor field. Some of the key technologies of the approach include bonding, through silicon via (TSV), thinning and handling. The focused key...
| Main Authors: | , |
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| Format: | Others |
| Language: | en_US |
| Published: |
2017
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| Online Access: | http://ndltd.ncl.edu.tw/handle/32xvt8 |