Heterogeneous chip power delivery modeling and co-synthesis for practical 3DIC realization
碩士 === 國立交通大學 === 電子研究所 === 105 === Three dimensional IC (3DIC) is becoming practical in today's consumer electronics designs. However, one major problem remains in design synthesis and flow: how to model heterogeneous die(s) with major logic die for power synthesis and signoff. This work provi...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2017
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| Online Access: | http://ndltd.ncl.edu.tw/handle/02757335338624606899 |