| Summary: | 碩士 === 國立交通大學 === 電子研究所 === 105 === Although chip-level heterogeneous integration provides high yield, its low throughput issue is necessary to be addressed. With regard to the integration of microelectromechanical systems (MEMS) and biomedical microsystem, handling issue and alignment accuracy are the factors that impact the difficulty in integration due to the uneven topography and small chip size. These problems are related to throughput of both chip stacking and the following bonding process.
Self-assembly technology has a high potential in 3D heterogeneous integration. Through hydrophobic film to define the desired stacking areas, hydrophilic chips can be assembled on these areas by the surface tension of water in a short time and accomplish alignment process. In this thesis, double-self-assembly technology is introduced to settle both handling and alignment issues for uneven topography chip microsystem integration, such as biomedical and MEMS applications. In this research, the μ-pillar chips are demonstrated to simulate the microsystem to investigate the optimal water volume for self-assembly process under various pillar heights to achieve high self-assembly ability. By achieving this ability, temporary bonding on carrier wafers can also be realized. Furthermore, the optimal water volume for different chip size is researched. Under misalignment measurement, high alignment accuracy can be accomplished with the optimal water volume for self-assembly process.
In this thesis, the microstructure of bonded structures and corresponding electrical analysis are proposed. Moreover, various reliability tests are undertaken to examine the bonding quality. Excellent bonding results prove that this double-self-assembly technology is applicable to 3D heterogeneous integration for uneven-topography biomedical MEMS chip integration.
|
|---|
