Uneven-Topography-Chip 3D Heterogeneous Integration Using Double-Self-Assembly Technology for MEMS and Biomedical Microsystem Applications
碩士 === 國立交通大學 === 電子研究所 === 105 === Although chip-level heterogeneous integration provides high yield, its low throughput issue is necessary to be addressed. With regard to the integration of microelectromechanical systems (MEMS) and biomedical microsystem, handling issue and alignment accuracy are...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2016
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| Online Access: | http://ndltd.ncl.edu.tw/handle/36225008560192388590 |