Prediction of the Chemical Mechanical Polishing Removal Rate by Using a Combination of Deep Neural Network and Random Forest
碩士 === 國立交通大學 === 統計學研究所 === 105 === In recent years, the semiconductor industry is very flourishing. However, a cumbersome process requires sophisticated control to achieve the high yield rate and keep the cost down actually. And the yield of the wafer is related to the removal rate in the Chemical...
| Main Authors: | , |
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| Format: | Others |
| Language: | en_US |
| Published: |
2017
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| Online Access: | http://ndltd.ncl.edu.tw/handle/9xwhbx |