Study of Sn Grain Microstructures on Electromigration Failure Mechanisms.
碩士 === 國立交通大學 === 材料科學與工程學系所 === 105 === To meet the increasing demand of device densities, microbumps in three-dimensional integrated circuits have been widely adopted. Since the joint size dramatically shrinks, there is a limited number of the solder grains, and the size of each grain would play a...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2016
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| Online Access: | http://ndltd.ncl.edu.tw/handle/83759411858444007337 |