Combine FEA and Taguchi Methods for Package Optimization of High Power Devices due to Thermal Stress

• Main Authors: Yen-Ming Chen, 陳彥名
• Other Authors: 林明澤
• Format: Others
• Language: zh-TW
• Published: 2017
• Online Access: http://ndltd.ncl.edu.tw/handle/69501149431249462103

碩士 === 國立中興大學 === 精密工程學系所 === 105 === The electronics packaging technology is now moving in a light, thin and short direction. The main package is intended to provide a means of power transmission, signal transmission, thermal removal and circuit protection. The heat generated by the operation of each electronic component must also be considered in the design of the assembly to keep the operating temperature of the electronic product within a reasonable range so that the electronic product can operate effectively and maintain the reliability of the product. The main purpose of the study is to explore the high-power electronic: when the pressure sealant is cooled from the high temperature of 170℃ to room temperature, due to the differences in material properties and shrinkage, internal residual stress is generated and warping or damage to the constituent elements happen, which lead to various problems such as pin deviation, solder contact failure, breakage, and no signal. In this study, we intend to measure the warpage of high power element sealant after cooling, and verify the warpage by finite element method.