Combine FEA and Taguchi Methods for Package Optimization of High Power Devices due to Thermal Stress
碩士 === 國立中興大學 === 精密工程學系所 === 105 === The electronics packaging technology is now moving in a light, thin and short direction. The main package is intended to provide a means of power transmission, signal transmission, thermal removal and circuit protection. The heat generated by the operation of ea...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2017
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| Online Access: | http://ndltd.ncl.edu.tw/handle/69501149431249462103 |