Electromagnetic-radiation-enhanced Cu-to-Cu direct bonding for microelectronic contacts
碩士 === 國立中興大學 === 材料科學與工程學系所 === 105 === In order to allow conductance between stacked ICs, jointing by metallic connections, i.e. electroplated copper-TSV, is necessary. Cu-to-Cu bonding is ideal to form required interconnections because copper possesses many advantages, e.g., excellent electrical...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2017
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| Online Access: | http://ndltd.ncl.edu.tw/handle/66405144179016902832 |