A Process for Polyimide Film Metallization by Using Reduced Graphene Oxide as a Conducting Layer
碩士 === 國立中興大學 === 化學工程學系所 === 105 === With technology developing, a lot of communication electronics tend to be light in order to keep with the advent of wearable devices. Polyimide (PI) film is an insulator and has been commonly used as a dielectric layer of a flexible printed circuit board (FPCB)...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2017
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| Online Access: | http://ndltd.ncl.edu.tw/handle/83650537134995699623 |