Studies on the Reliability Analysis of Package on Package Product by Using Die Attach Film
碩士 === 國立高雄應用科技大學 === 化學工程與材料工程系碩士在職專班 === 105 === The purpose of this paper is to explore die attach film for 2.5D stacked package on package products, including thermosetting and two different properties of thermoplastic films. It was found that the low viscoelastic coefficient and the low thermal...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2017
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| Online Access: | http://ndltd.ncl.edu.tw/handle/25819750637224143917 |