Epoxy Molding Compound For Flip Chip Device Internal Void Improvement And Reliability Analysis
碩士 === 國立高雄應用科技大學 === 化學工程與材料工程系博碩士班 === 107 === In this study, the purpose is to improve “Mold void” that is commonly problems in the molding process. There are two parts of discuss in this paper. The first is changing the molding process temperature to improve the epoxy resin (Epoxy Molding Compou...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2018
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| Online Access: | http://ndltd.ncl.edu.tw/handle/4rg996 |