Opimize the Warpage of Phone SIM Card Tray of Four-Cavity Mold by Moldflow Analysis
碩士 === 逢甲大學 === 機械與電腦輔助工程學系 === 105 === This study investigated the subscriber identity module (SIM) tray of a mobile phone using Autodesk Simulation Moldflow Synergy, a computer-aided software package. Because SIM trays require excellent dimensional precision for compatibility with the components o...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2017
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| Online Access: | http://ndltd.ncl.edu.tw/handle/6b9y62 |