Bending and laminating module design for Fingerprint Identification components

• Main Authors: Shou Man-Wu, 吳守滿
• Other Authors: Yung-Ding
• Format: Others
• Language: zh-TW
• Published: 2017
• Online Access: http://ndltd.ncl.edu.tw/handle/a3hp6n

碩士 === 中原大學 === 機械工程研究所 === 105 === Abstract A micro-wound element is designed for the bending and fitting module of the finge rprint identification. The ultrasonic fingerprint identification component is different from the general fingerprint identification since the launch units in front of FPC need to be attached to the other side of the TFT. Automatic alignment is more difficult than the composite chip of multi-layer component. The bonding circuit conduction of the soft cable between the FPC and the TFT combines them. After the completion of position identification, the position compensation cannot manage only two independent individuals. The position compensation method is designed with the characteristics of the workpiece, which includes two different methods to deal with two component cable connection. As a result, compensation offset problem occurs. The first method is the three axial (XYθ) standard compensation with respect to the rotation compensation amount along the X direction. This method can effectively reduce the amount of deviation, but some unstable factors still exist. Because the X-direction rotation compensation amount and the angle deviation cannot fully match, bonding accuracy is not acceptable that makes performance of Cpk cannot meet the process specifications. Avoid from the workpiece offset caused by the X-direction compensation, the second method deal with the amount of deviation of the workpiece using the Y-axis and the θ-axis that can exclude the offset error due to workpiece stretched and pulled though with a fixed calculation error. At the sacrifice of Ca, high efficiency of Laminating Cp value is increased, that improve the entire process of Cpk. In practice, the measured Cpk verification of three testing points can reach above 1.33. Keywords: Laminating technology、fingerprint identification、visual alignment、Cpk(Complex Process Capability index)