Bending and laminating module design for Fingerprint Identification components
碩士 === 中原大學 === 機械工程研究所 === 105 === Abstract A micro-wound element is designed for the bending and fitting module of the finge rprint identification. The ultrasonic fingerprint identification component is different from the general fingerprint identification since the launch units in front of FPC...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2017
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| Online Access: | http://ndltd.ncl.edu.tw/handle/a3hp6n |