Apply Wireless Ad-hoc Network Algorithm in Redistribution Obstacle-Avoiding
碩士 === 淡江大學 === 電機工程學系碩士班 === 104 === Redistribution layer(RDL), which abundantly applied on Flip-chip technology in recent years. Flip-chip is similar to conventional IC fabrication with a few additional steps, the chip is inverted to bring the solder down so that the solder balls are facing th...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2016
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| Online Access: | http://ndltd.ncl.edu.tw/handle/07464279588607546813 |