| Summary: | 碩士 === 國立臺北科技大學 === 製造科技研究所 === 104 === A plastic part of headphone support frame composed of main body and rear cover. The rear cover has larger shrinkage warpage after injection molding. Thus, the rear cover cannot assembly with main body.
In this study, Moldex3D software was used to execute CAE simulation analysis for a two-cavity mold design, and to explore the warpage of the rear cover. First, Taguchi method was used to make a noise experiment. There are three significant noise factors including mold temperature, gate diameter, and packing pressure, respectively. These factors are further combined to a compound noise factor. Secondly, L18 (21×37) orthogonal array was used in main experiment to find the significant factors that affect the rear cover warpage, and optimize injection molding parameters.
Results show the significant factors affect S/N ratio are packing pressure mold temperature, and gate diameter. Analysis of Variance (ANOVA), was employed to inspect these significant factors. Finally, it make use of confirm experiment and confidence intervals to verify the experimental results. Results also show the significant factors influence warpage is same as the result of Taguchi Methods under 95% confidence levels. Confirm experimental values and the predict value are enough closed, that is, this experimental model is adequate accurate.
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