Study on the Warpage Reduction of Headphone Support Frame Rear Cover by CAE
碩士 === 國立臺北科技大學 === 製造科技研究所 === 104 === A plastic part of headphone support frame composed of main body and rear cover. The rear cover has larger shrinkage warpage after injection molding. Thus, the rear cover cannot assembly with main body. In this study, Moldex3D software was used to execute CAE s...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Online Access: | http://ndltd.ncl.edu.tw/handle/zb6rz5 |