Improved Characteristics of Electroplating Copper as Rear Electrode of Monocrystalline Silicon Solar Cells by Wet Etching and Evaporation Process
碩士 === 國立虎尾科技大學 === 光電工程系光電與材料科技碩士班 === 104 === In this study, improved adhesion of electroplated copper as rear electrode of monocrystalline silicon solar cells (MSSCs) was presented by wet etching process. The wet etching solutions include silver nitrate (AgNO3)/hydrofluoric acid (HF) and nitrate...
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2016
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| Online Access: | http://ndltd.ncl.edu.tw/handle/9kqtwd |