The Study of Warpage of Flip Chip Embedded Trace Substrate
碩士 === 國立高雄大學 === 電機工程學系--先進電子構裝技術產業研發碩士專班 === 104 === This is focus on the investigation of bending substrate of FcCSP - ETS substrate. The deformation of bending substrate makes difficulty in Semiconductor Packaging Process. However, substrate bending due to large shrinkage of stressed substrate...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2016
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| Online Access: | http://ndltd.ncl.edu.tw/handle/32407289420866896228 |