The Study of Tensile Strength Measurement and Application for Die Pull Test

• Main Authors: KO,HSING-FEI, 柯星妃
• Other Authors: SHIH,MING-CHANG
• Format: Others
• Language: zh-TW
• Published: 2016
• Online Access: http://ndltd.ncl.edu.tw/handle/45168273599185332671

碩士 === 國立高雄大學 === 電機工程學系--先進電子構裝技術產業研發碩士專班 === 104 === 　　Usually, mechanized strength test is time consuming and may have errors caused by defects and issues of accuracy. In this thesis a new method of grain tensile strength tests(Die Pull Test) was to verify the strength of the adhesion film in package. If shows that this method can improve the testing time and yield rate of package with grade structure layers. In convention, Die Pull Test may also limited by sample size which is too small to be tested by conventional testing approach. 　　We show that this new method of Die Pull Test is able to improved small size die testing problems especially to located and to improve the accuracy of the test sample shortcomings mode. In addition, various drawbacks mode of adhesion can be defined such as robustness, ruggedness. A fixture for aligning the position of the tested die to improve the accuracy. The sample tested has been designed to improve the accuracy of the testing.