The Study of Tensile Strength Measurement and Application for Die Pull Test

碩士 === 國立高雄大學 === 電機工程學系--先進電子構裝技術產業研發碩士專班 === 104 ===   Usually, mechanized strength test is time consuming and may have errors caused by defects and issues of accuracy. In this thesis a new method of grain tensile strength tests(Die Pull Test) was to verify the strength of the adhesion film in pac...

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Bibliographic Details
Main Authors: KO,HSING-FEI, 柯星妃
Other Authors: SHIH,MING-CHANG
Format: Others
Language:zh-TW
Published: 2016
Online Access:http://ndltd.ncl.edu.tw/handle/45168273599185332671