Fabrication of low-k porous SiO2/PLA hybrid film

• Main Authors: Tao-Hung Chang, 張道弘
• Other Authors: Shao-ju Shih
• Format: Others
• Language: zh-TW
• Published: 2016
• Online Access: http://ndltd.ncl.edu.tw/handle/7h7u8j

碩士 === 國立臺灣科技大學 === 材料科學與工程系 === 104 === Silica (SiO2) materials are widely used as drug carriers, thermal insulators, and low-k dielectric materials. Furthermore, porous SiO2 is one of the candidates for low-k dielectrics due to its superior properties of low cost, high thermal stability, high chemical resistance, and low dielectric constant. So far, the common method of fabricating the porous SiO2 is the sol-gel method; however, this method contains the drawbacks of discontinuous process and long process time deteriorate poteneial, which is not suitable for mass production. This study proposed the one-step and continuous method of spray pyrolysis (SP) to prepare porous SiO2 particles. The experimental results showed that the various porous structure of SiO2 particles were achieved by using the mixed precursor solutions of tetraethyl orthosilicate and various pore-forming agents (agar, PEG 600, and F127) for SP. Moreover, the phase compositions were analyzed by X-ray diffraction, the surface morphologies and particle size distributions were characterized by scanning electron microscopy, and the geometry was observed by transmission electron microscopy. Also, the SP formation mechanisms of porous silica particles using various pore-forming( agents agar, PEG 600, and F127 )were discussed.