Fabrication of low-k porous SiO2/PLA hybrid film
碩士 === 國立臺灣科技大學 === 材料科學與工程系 === 104 === Silica (SiO2) materials are widely used as drug carriers, thermal insulators, and low-k dielectric materials. Furthermore, porous SiO2 is one of the candidates for low-k dielectrics due to its superior properties of low cost, high thermal stability, high chem...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2016
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| Online Access: | http://ndltd.ncl.edu.tw/handle/7h7u8j |