Diffraction Based Overlay Target Design for On-Product Overlay Measurement

碩士 === 國立臺灣科技大學 === 自動化及控制研究所 === 104 === To acquire the advanced-node technology, overlay becomes the key challenges for the nano-lithography in the semiconductor manufacturing. Overlay needs to evolve to accurately represent product device patterns for the control of overlay errors. The diffractio...

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Main Author: Anifatul Faricha
Other Authors: Hung-Fei Kuo
Format: Others
Language:en_US
Published: 2016
Online Access:http://ndltd.ncl.edu.tw/handle/t6ec6a
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spelling ndltd-TW-104NTUS51460222019-05-15T23:01:17Z http://ndltd.ncl.edu.tw/handle/t6ec6a Diffraction Based Overlay Target Design for On-Product Overlay Measurement Diffraction Based Overlay Target Design for On-Product Overlay Measurement Anifatul Faricha Anifatul Faricha 碩士 國立臺灣科技大學 自動化及控制研究所 104 To acquire the advanced-node technology, overlay becomes the key challenges for the nano-lithography in the semiconductor manufacturing. Overlay needs to evolve to accurately represent product device patterns for the control of overlay errors. The diffraction based overlay (DBO) is considered as the promising method, it is fast, non-destructive, stable, and also well-suited to being integrated with a 193-immersion lithography system for controlling the lithography process variations from die-to-die, wafer-to-wafer, and lot-to-lot. The DBO target is the candidate for the on-product overlay control since the DBO’s accuracy and resolution are beyond the diffraction limit. The calculation is more complicated and involved many sophisticated overlay target designs which should be robust against symmetry and asymmetry variation. Several resolution enhancement techniques (RET) such as sub-resolution assist feature (SRAF) and segmentation, are employed to meet the optimal overlay product. In this study, the segmented with SRAF model provided the sharpest aerial image contrast and the lowest critical (CD) error among other models. The feed-forward ANN model was integrated with the scatterometry to assess the resist CD profile in the DBO measurement. Based on the integrated ANN-scatterometry technique, the segmented with SRAF model had the closest result of resist CD profile to the device target among other models. The ANN-scatterometry technique, which was also used for predicting displacement offset of the DBO target with various SWAs, was successfully demonstrated. The numerical result of the minimum square error and the mean of residual in the flat region showed that the ANN model provided more effective displacement offset prediction than the linear and high order regression models, which implemented in the current scatterometry system. Hung-Fei Kuo Hung-Fei Kuo 2016 學位論文 ; thesis 78 en_US
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language en_US
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description 碩士 === 國立臺灣科技大學 === 自動化及控制研究所 === 104 === To acquire the advanced-node technology, overlay becomes the key challenges for the nano-lithography in the semiconductor manufacturing. Overlay needs to evolve to accurately represent product device patterns for the control of overlay errors. The diffraction based overlay (DBO) is considered as the promising method, it is fast, non-destructive, stable, and also well-suited to being integrated with a 193-immersion lithography system for controlling the lithography process variations from die-to-die, wafer-to-wafer, and lot-to-lot. The DBO target is the candidate for the on-product overlay control since the DBO’s accuracy and resolution are beyond the diffraction limit. The calculation is more complicated and involved many sophisticated overlay target designs which should be robust against symmetry and asymmetry variation. Several resolution enhancement techniques (RET) such as sub-resolution assist feature (SRAF) and segmentation, are employed to meet the optimal overlay product. In this study, the segmented with SRAF model provided the sharpest aerial image contrast and the lowest critical (CD) error among other models. The feed-forward ANN model was integrated with the scatterometry to assess the resist CD profile in the DBO measurement. Based on the integrated ANN-scatterometry technique, the segmented with SRAF model had the closest result of resist CD profile to the device target among other models. The ANN-scatterometry technique, which was also used for predicting displacement offset of the DBO target with various SWAs, was successfully demonstrated. The numerical result of the minimum square error and the mean of residual in the flat region showed that the ANN model provided more effective displacement offset prediction than the linear and high order regression models, which implemented in the current scatterometry system.
author2 Hung-Fei Kuo
author_facet Hung-Fei Kuo
Anifatul Faricha
Anifatul Faricha
author Anifatul Faricha
Anifatul Faricha
spellingShingle Anifatul Faricha
Anifatul Faricha
Diffraction Based Overlay Target Design for On-Product Overlay Measurement
author_sort Anifatul Faricha
title Diffraction Based Overlay Target Design for On-Product Overlay Measurement
title_short Diffraction Based Overlay Target Design for On-Product Overlay Measurement
title_full Diffraction Based Overlay Target Design for On-Product Overlay Measurement
title_fullStr Diffraction Based Overlay Target Design for On-Product Overlay Measurement
title_full_unstemmed Diffraction Based Overlay Target Design for On-Product Overlay Measurement
title_sort diffraction based overlay target design for on-product overlay measurement
publishDate 2016
url http://ndltd.ncl.edu.tw/handle/t6ec6a
work_keys_str_mv AT anifatulfaricha diffractionbasedoverlaytargetdesignforonproductoverlaymeasurement
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