Electrochemical migration behavior and its improvement of printed fine-pitch Ag interconnects
碩士 === 國立清華大學 === 工程與系統科學系 === 104 === With the development of intelligent electronic products, usage of fine-pitch interconnects became mainstream in high performance electronic devices. Electrochemical migration (ECM) of interconnects would be a serious reliability problem under temperature, humid...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2016
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| Online Access: | http://ndltd.ncl.edu.tw/handle/62419637235941183369 |