Development of advanced interconnect alloys for SOFC interconnect application
碩士 === 國立清華大學 === 材料科學工程學系 === 104 === In present study, the formability of Ni-based CMH1, Ni-Fe-based CMH2, and Fe-based CMH3 has been evaluated by the Gleeble-3500 thermo-mechanical simulator with the assistance of CALPHAD-base Jmatpro and Deform-3D simulation software. The effect of 100 ppm yttri...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2016
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| Online Access: | http://ndltd.ncl.edu.tw/handle/08989117328481161230 |