Effects of die thickness and underfill dispensing shape on structural stresses in a CSP module under the conditions of reflow, underfill curing process, and temperature cycling.
碩士 === 國立屏東科技大學 === 機械工程系所 === 104 === This study reports the improvement of a commercial product of CSP module, in which the underfill is not dispensed, leading to the electricity failure after temperature cycling test (300 cycles). This is attributed to the rupture of solder balls through the fail...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2016
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| Online Access: | http://ndltd.ncl.edu.tw/handle/05363384824857224193 |