Reliability Evaluation of Adding Additional Elements into Pb-free Solder Balls on IC Substrate Board

碩士 === 國立高雄第一科技大學 === 電腦與通訊工程研究所 === 104

Bibliographic Details
Main Authors: Gui-Ching Feng, 馮桂清
Other Authors: Miin-jong Hao
Format: Others
Language:zh-TW
Published: 2016
Online Access:http://ndltd.ncl.edu.tw/handle/44244330056100473343