Optimization analysis of silver wire package bonding parameters
碩士 === 國立中央大學 === 機械工程學系在職專班 === 104 === Packaging wire bonding technology has been around for ages, is electrical connection technology, widely used in the microelectronics field, facing high density, complexity, small size of portable low-cost products, we need to implement mounting technology to...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2016
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| Online Access: | http://ndltd.ncl.edu.tw/handle/78498669407253368968 |