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碩士 === 國立中央大學 === 化學工程與材料工程學系 === 104 === In this study, the electroless plating Co (W, P) surface finish was successfully plated on printed circuit boards (PCBs). According to surface analysis and test, the electroless plating Co (W, P) in our work perform well quality and adhesion. Furthermore, th...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2016
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| Online Access: | http://ndltd.ncl.edu.tw/handle/48567227396486700159 |