Study of vertical interconnects of 3D IC: Cu3Sn joints and Au-to-Au direct bonding
博士 === 國立交通大學 === 材料科學與工程學系所 === 104 === With evolution of technology, more multi-function chips have be integrated into electronic devices. The “multi-function” means more transistors being placed onto the unit area of each electric component. In the aspect of electronic packaging, it makes smaller...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2015
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| Online Access: | http://ndltd.ncl.edu.tw/handle/hxtn26 |