Effect of Aging and Low Cycles Fatigue Properties of Sn-xAg-0.7Cu Lead-Free Solder Joints
碩士 === 國立成功大學 === 機械工程學系 === 104 === The effect of different Ag addition (0~3 Wt. %) on the IMC layer thickness and mechanical properties of Sn-xAg-Cu solder joint was studied. Single-lap shear test was carried out where solder joint was performed on performed copper sheets. Meanwhile, microstructu...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2016
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| Online Access: | http://ndltd.ncl.edu.tw/handle/86303941444213569585 |