Microstructure and Low Cycle Fatigue Property of Sn-xAg-0.7Cu Lead-Free Solder Joints
博士 === 國立成功大學 === 機械工程學系 === 104 === The microstructure evolution and mechanical properties of Ag3Sn was studied under different cooling rate with different Ag contents SAC solders. When the cooling rate slowed and the solidification time extended, the morphology of the Ag3Sn changed from particle-l...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2016
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| Online Access: | http://ndltd.ncl.edu.tw/handle/17314667115575732461 |