Analysis of Debond Propagation on the Polymer-Cu Thin-Film Interface
碩士 === 國立成功大學 === 機械工程學系 === 104 === Debonding of dissimilar materials interface is a critical issue to be considered in the microelectronics industry. In this thesis debond propagation on the polymer-Cu thin-film interface is considered. The mixed-mode critical strain energy release rate of two pol...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2016
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| Online Access: | http://ndltd.ncl.edu.tw/handle/88041417523300548010 |