Study on Thermal-induced Delamination and Fracture of Through Silicon Via structures.
碩士 === 國立成功大學 === 機械工程學系 === 104 === Recently, through silicon via structure (TSV) technology has become important in three-dimension technology, because it provides the short distance connection can also be internal electrical conduction and thermal conduction. TSV structure of process technology d...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2016
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| Online Access: | http://ndltd.ncl.edu.tw/handle/64591368596657684807 |