Electromigration-induced microstructure evolution in Ag-Cu alloys
碩士 === 國立成功大學 === 材料科學及工程學系 === 104 === As the technologies in microelectronic industry are being developed, miniaturization of electronic products is inevitable. However, as miniaturization requires much smaller interconnects, the current density goes up, as well as the probability of circuit failu...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2016
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| Online Access: | http://ndltd.ncl.edu.tw/handle/33862836773769397288 |