Assembly and Reliability Characterization of 2.5D System in Packaging with 45μm Pitch Lead-free Microbump Interconnection
博士 === 國立成功大學 === 工程科學系 === 104 === In this study, the validation reliability test of 2.5D IC package design is introduced. The 28nm quad core ASIC (Application Specific IC) and HBM (High Bandwidth Memory) are mounted side by side on an interposer with 45μm pitch Cu pillar bumps. A representative si...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2016
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/j88x24 |