Effects of Time and Temperature on Al–Ti Alloy Thin Film Creep Behavior Using Bulge Test

• Main Authors: Shao-Chi Wu, 吳少淇
• Other Authors: Ming-Tzer Lin
• Format: Others
• Language: zh-TW
• Published: 2016
• Online Access: http://ndltd.ncl.edu.tw/handle/49301713153758325879

碩士 === 國立中興大學 === 精密工程學系所 === 104 === The Al-Ti alloy has become a widely used material for MEMS devices such as an RF MEMS switch in recent years. Reliability is always a problem when moving parts of MEMS components such as switches and mirrors, operate at high temperature for a long time. In order to manufacture MEMS devices with higher reliability, we need to understand mechanical properties of the material better. In this study, we deposited four kinds ratio of Al-Ti alloy films on specimens by using a sputtering system and use bulge test to measure mechanical properties of Al –Ti alloy films. The principle of bulge test is to apply stress on a film and measure the height of this film by PSD (Position Sensing Detector), then we can use the relationship between the stress and the height of this film to calculate the film''s strain and stress by formulas. Experiment is divided into stress-strain tests and creep tests, stress-strain tests can obtain the Young''s modulus and residual stress of the films, and the creep test can observe creep behavior of the films. The results show that Al-Ti alloy thin film containing the higher titanium content, the higher its Young’s modulus, and better creep resistance capacity.