Effects of Time and Temperature on Al–Ti Alloy Thin Film Creep Behavior Using Bulge Test
碩士 === 國立中興大學 === 精密工程學系所 === 104 === The Al-Ti alloy has become a widely used material for MEMS devices such as an RF MEMS switch in recent years. Reliability is always a problem when moving parts of MEMS components such as switches and mirrors, operate at high temperature for a long time. In order...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2016
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| Online Access: | http://ndltd.ncl.edu.tw/handle/49301713153758325879 |