Electromigration effects between the flip-chip solder and copper pad
碩士 === 國立中興大學 === 精密工程學系所 === 104 === In this study, the investigation of electromigration defects due to currents stress effects between solder and copper substrate were performed. Experiments were tested during heating,heating and applied current,heating, applied current and applied stress. We obs...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2016
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| Online Access: | http://ndltd.ncl.edu.tw/handle/02485286335644416256 |