Stress Analysis and Mobility Model for 3D FinFET
碩士 === 國立中興大學 === 電機工程學系所 === 104 === The stress distribution and magnitude of 3D FinFET cause by each process steps is studied in this work. SolidWorks is first applied to drawing the 3D FinFET structural diagram , and then , the ANSYS stress analysis simulator is utilized for simulating each proce...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2016
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| Online Access: | http://ndltd.ncl.edu.tw/handle/14913719739273682816 |