Effects of electroplating additives on void formation at the Sn/electroplated Cu solder joints
碩士 === 國立中興大學 === 化學工程學系所 === 104 === In this generation of high technology, the electronic products are filled with our daily life. In order to elevate the portability of electronic products, the inner components are developed toward the miniature size. The reduced volume of solder joints make the...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2016
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| Online Access: | http://ndltd.ncl.edu.tw/handle/33862850686672477387 |